Overview
RCC Materials, short for Resin Coated Copper Materials, are advanced PCB substrate materials consisting of a thin copper foil coated with a specially formulated dielectric resin layer. RCC materials are widely used in HDI (High Density Interconnect) PCBs, semiconductor substrates, mobile devices, and advanced electronic packaging applications.
Unlike conventional copper-clad laminates (CCL), RCC materials eliminate the need for traditional fiberglass reinforcement layers, enabling thinner PCB constructions, finer circuitry, improved laser microvia formation, and higher interconnect density.
RCC materials are widely used in:
- HDI PCBs
- Smartphones
- Tablets
- Wearable Electronics
- Semiconductor Packaging
- AI Computing Hardware
- Automotive Electronics
- High-Speed Communication Equipment
Due to their ultra-thin structure and excellent processability, RCC materials are a critical technology for next-generation miniaturized electronic products.
Material Specification
| Property | Value |
|---|---|
| Material Designation | RCC |
| Full Name | Resin Coated Copper |
| Material Family | HDI Build-Up Material |
| Structure | Copper Foil + Resin Layer |
| Typical Thickness | 12–100 μm |
| Dielectric Constant (Dk) | 3.0–4.2 |
| Dissipation Factor (Df) | 0.003–0.020 |
| Manufacturing Method | Sequential Lamination |
| Standard Forms | RCC Sheets, Build-Up Layers |
Material Structure
RCC materials consist of a copper foil directly coated with a dielectric resin system.
| Layer | Function |
|---|---|
| Copper Foil | Electrical Conductor |
| Resin Coating | Dielectric Insulation |
| Laser Microvias | Interlayer Connection |
| Build-Up Layers | HDI Structure Formation |
The elimination of woven glass fibers allows superior laser drilling performance and finer circuit geometries.
Common RCC Material Types
| Type | Characteristics |
|---|---|
| Standard RCC | General HDI Applications |
| Low Loss RCC | High-Speed Digital Systems |
| Halogen-Free RCC | Environmentally Friendly Designs |
| High Tg RCC | Enhanced Thermal Reliability |
| Semiconductor RCC | IC Substrate Applications |
| Ultra-Thin RCC | Mobile Devices & Wearables |
Resin Systems Used in RCC
| Resin Type | Characteristics |
|---|---|
| Epoxy Resin | Standard HDI Applications |
| Modified Epoxy | Improved Thermal Performance |
| BT Resin | IC Packaging |
| Low-Loss Resin | High-Speed Signal Transmission |
| Halogen-Free Resin | Green Electronics |
Different resin systems are selected based on electrical, thermal, and reliability requirements.
Mechanical Properties
Typical Values
| Property | Value |
|---|---|
| Tensile Strength | 50–150 MPa |
| Elastic Modulus | 2–8 GPa |
| Peel Strength | Excellent |
| Dimensional Stability | Excellent |
| Via Reliability | Outstanding |
Mechanical Performance
| Property | Performance |
|---|---|
| Layer Adhesion | Excellent |
| Thermal Cycling Reliability | Excellent |
| Mechanical Stability | Excellent |
| Build-Up Layer Integrity | Outstanding |
RCC materials are specifically engineered for multilayer HDI constructions.
Physical Properties
| Property | Value |
|---|---|
| Density | 1.1–1.8 g/cm³ |
| Moisture Absorption | Very Low |
| Surface Smoothness | Excellent |
| Flatness | Outstanding |
| Dimensional Stability | Excellent |
The smooth resin surface enables ultra-fine circuit fabrication.
Thermal Properties
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) | 150–220°C |
| Decomposition Temperature (Td) | >300°C |
| Continuous Service Temperature | 130–180°C |
| Lead-Free Assembly Compatibility | Excellent |
| Thermal Expansion Control | Good |
Modern RCC materials are designed to withstand multiple lead-free solder reflow cycles.
Electrical Properties
Typical Values
| Property | Value |
|---|---|
| Dielectric Constant (Dk) | 3.0–4.2 |
| Dissipation Factor (Df) | 0.003–0.020 |
| Volume Resistivity | >10¹⁴ Ω·cm |
| Surface Resistivity | >10¹³ Ω |
| Dielectric Strength | Excellent |
Electrical Performance
| Property | Performance |
|---|---|
| Signal Integrity | Excellent |
| High-Speed Digital Performance | Excellent |
| Impedance Control | Excellent |
| Crosstalk Suppression | Excellent |
Low-loss RCC grades support modern high-speed digital and networking applications.
Laser Drilling Performance
| Property | Performance |
|---|---|
| Laser Drillability | Outstanding |
| Microvia Accuracy | Outstanding |
| Via Wall Quality | Excellent |
| Stacked Via Compatibility | Excellent |
RCC materials are optimized for laser microvia formation used in HDI PCB manufacturing.
Thermal Reliability
| Property | Performance |
|---|---|
| Thermal Shock Resistance | Excellent |
| Delamination Resistance | Excellent |
| Via Fatigue Resistance | Outstanding |
| Long-Term Reliability | Excellent |
These characteristics make RCC suitable for demanding electronics applications.
Moisture Resistance
| Property | Performance |
|---|---|
| Water Absorption | Very Low |
| Humidity Resistance | Excellent |
| Electrical Stability | Excellent |
| Environmental Reliability | Excellent |
Low moisture absorption contributes to stable electrical performance.
Manufacturing Characteristics
| Manufacturing Process | Rating |
|---|---|
| Sequential Lamination | Outstanding |
| Laser Drilling | Outstanding |
| HDI PCB Fabrication | Outstanding |
| Fine Line Circuit Processing | Outstanding |
| Semiconductor Packaging | Excellent |
RCC is one of the most widely used materials in HDI build-up technology.
International Standards
| Standard | Compliance |
|---|---|
| IPC-4101 | Applicable |
| IPC-6016 | Applicable |
| RoHS | Compliant |
| REACH | Compliant |
| UL Certification | Available |
Available Forms
| Product Type | Availability |
|---|---|
| RCC Sheets | Yes |
| HDI Build-Up Layers | Yes |
| Semiconductor Substrate Materials | Yes |
| Ultra-Thin Copper Structures | Yes |
| High-Speed RCC Materials | Yes |
Typical Applications
Consumer Electronics
- Smartphones
- Tablets
- Smart Watches
- Wireless Earbuds
HDI PCB Manufacturing
- High-Density PCBs
- Fine Pitch Electronics
- Miniaturized Circuit Boards
Semiconductor Packaging
- IC Substrates
- Advanced Packaging
- Chiplet Architectures
- AI Processors
Automotive Electronics
- ADAS Systems
- Radar Modules
- EV Electronics
- Automotive Controllers
Telecommunications
- 5G Infrastructure
- High-Speed Networking
- Optical Communication Equipment
Data Centers
- AI Servers
- GPU Modules
- High-Performance Computing Platforms
Advantages
Ultra-Thin Structure
Enables thinner and lighter electronic products.
Excellent Laser Drillability
Supports reliable microvia formation.
High Routing Density
Allows finer traces and increased interconnect density.
Improved Signal Performance
Suitable for high-speed digital systems.
Excellent Manufacturing Efficiency
Compatible with advanced HDI production processes.
Supports Product Miniaturization
Critical for modern portable electronics.
Limitations
Higher Material Cost
More expensive than conventional PCB laminates.
Specialized Manufacturing Requirements
Requires advanced HDI fabrication equipment.
Lower Mechanical Rigidity
Compared with fiberglass-reinforced laminates.
Limited Structural Support
Generally used as build-up layers rather than core materials.
Comparison with PCB Material Technologies
| Property | RCC Materials | Standard FR4 | ABF | Build-Up Film |
|---|---|---|---|---|
| Thickness | Ultra-Thin | Thick | Ultra-Thin | Thin |
| Laser Drillability | Outstanding | Moderate | Outstanding | Outstanding |
| HDI Compatibility | Outstanding | Limited | Outstanding | Outstanding |
| Routing Density | Outstanding | Moderate | Outstanding | Excellent |
| Cost | High | Low | Very High | High |
Comparison with Traditional Copper-Clad Laminates
| Property | RCC Materials | Traditional CCL |
|---|---|---|
| Thickness | Thinner | |
| HDI Capability | Better | |
| Microvia Formation | Better | |
| Fine Line Processing | Better | |
| Miniaturization Support | Better |
RCC materials are specifically designed for HDI and advanced packaging applications.
Available Surface Finishes
Standard Finishes
- Copper Foil Surface
- Smooth Resin Surface
- Ultra-Thin Copper Finish
Functional Finishes
- HDI Build-Up Surface
- Semiconductor Substrate Surface
- Fine Line Circuit Surface
Specialty Configurations
- Standard RCC
- High Tg RCC
- Low Loss RCC
- Semiconductor RCC
- Ultra-Thin RCC
Frequently Asked Questions (FAQ)
What is RCC Material?
RCC (Resin Coated Copper) is a copper foil coated with a dielectric resin layer used in HDI PCB and semiconductor substrate manufacturing.
What is RCC used for?
Typical applications include:
- HDI PCBs
- Smartphones
- Semiconductor Packaging
- AI Hardware
- Automotive Electronics
Why use RCC instead of traditional laminates?
RCC enables thinner structures, finer traces, better microvia performance, and higher routing density.
Is RCC suitable for HDI PCBs?
Yes. RCC is one of the most commonly used materials in HDI PCB manufacturing.
Can RCC be laser drilled?
Yes. RCC materials are specifically optimized for laser microvia formation.
Why choose RCC Materials?
Because they provide:
- Ultra-Thin Structures
- Excellent Laser Drillability
- High Routing Density
- HDI Compatibility
- Superior Miniaturization Capability
What is the difference between RCC and ABF?
RCC is commonly used in HDI PCB build-up layers, while ABF is primarily used in advanced semiconductor package substrates.
Does GCNOV provide RCC PCB manufacturing services?
Yes. GCNOV provides:
- HDI PCB Manufacturing
- RCC Material Processing
- Microvia PCB Fabrication
- Semiconductor Substrate Support
- High-Speed PCB Solutions
- Prototype Development
- Low-Volume Production
- Mass Production