PCB & PCBA
Custom PCB & PCBA Fabrication Services
From Bare Printed Circuit Boards to Fully Assembled Electronic Products
GCNOV provides complete PCB fabrication and PCBA assembly services for electronic product developers, industrial manufacturers, and global OEM customers.
Our capabilities cover rigid, flexible, rigid-flex, multilayer, HDI, high-frequency, metal-core, and heavy-copper circuit boards. We also provide component sourcing, SMT assembly, through-hole assembly, mixed-technology assembly, programming, functional testing, conformal coating, cable integration, and box-build assembly.
Whether you require a few engineering prototypes or repeat production orders, GCNOV helps you shorten development cycles, simplify supply-chain management, and receive production-ready electronic assemblies from one manufacturing partner.

Our PCB & PCBA Fabrication Services
Complete Electronics Manufacturing Support
GCNOV supports customers throughout the complete electronics manufacturing process, from engineering review and bare-board fabrication to component assembly, testing, and final product integration.
PCB Fabrication
We manufacture custom printed circuit boards based on customer Gerber files, drawings, stack-up requirements, and electrical specifications.
Our PCB fabrication services include:
Single-sided PCB
Double-sided PCB
Multilayer PCB
Rigid PCB
Flexible PCB
Rigid-flex PCB
HDI PCB
High-frequency PCB
Aluminum PCB
Copper-core PCB
Heavy-copper PCB
Impedance-controlled PCB
High-Tg PCB
Prototype and production PCB
SMT Assembly
Our surface-mount assembly service supports fine-pitch and high-density electronic components using automated solder-paste printing, high-speed placement, reflow soldering, and optical inspection.
Typical SMT components include:
Resistors and capacitors
Diodes and transistors
Integrated circuits
QFN and DFN packages
BGA and micro-BGA packages
LGA packages
Fine-pitch ICs
Connectors
Sensors
LED components
Through-Hole Assembly
Through-hole technology is suitable for components requiring higher mechanical strength, higher current capacity, or manual installation.
Available processes include:
Manual component insertion
Automatic insertion
Wave soldering
Selective soldering
Hand soldering
Lead trimming
Post-solder inspection
PCB Testing and Inspection
Inspection and testing can be configured according to product complexity and customer requirements.
Available methods may include:
Automated Optical Inspection
Solder Paste Inspection
X-ray inspection
Flying-probe testing
In-circuit testing
Functional testing
Continuity testing
Impedance testing
Hi-pot testing
Burn-in testing
Firmware programming
Visual inspection

Why GCNOV
Why Choose GCNOV for PCB & PCBA Fabrication?
One Partner from PCB Prototype to Finished Product
GCNOV coordinates bare-board fabrication, component sourcing, assembly, testing, enclosure manufacturing, and final product integration. This reduces communication gaps between multiple suppliers.

- Engineering and DFM Support
Before production, our engineering team can review:
Gerber data
PCB stack-up
Drill files
Solder-mask clearance
Silkscreen placement
Component footprints
Panelization
BOM information
Pick-and-place files
Test requirements
Potential manufacturing and assembly issues can be identified before materials are released. - Component Supply-Chain Management
Our sourcing team reviews component availability, manufacturer part numbers, packaging, date codes, minimum order quantities, and potential supply risks.
We can work with customer-approved distributors and provide sourcing records when required. - Complete Mechanical Manufacturing Support
In addition to electronics manufacturing, GCNOV can coordinate:
CNC-machined enclosures
Sheet-metal housings
Injection-molded plastic parts
Heat sinks
Fasteners
Labels
Cable assemblies
Product packaging
This is especially useful for customers developing a complete electronic device rather than only a bare PCB assembly.
Custom PCB and PCBA Products We Manufacture
| Product Category | Typical Configuration | Common Applications |
|---|---|---|
| Rigid Circuit Boards | Single-, double- and multilayer PCB | Industrial controls, electronics, power systems |
| Flexible Circuits | Single- and multilayer flexible PCB | Wearables, cameras, compact electronic products |
| Rigid-Flex PCB | Combined rigid and flexible sections | Medical devices, sensors, portable equipment |
| HDI Circuit Boards | Microvias, fine lines and dense interconnects | Communication devices, compact electronics |
| High-Frequency PCB | Low-loss laminate and controlled impedance | RF systems, antennas, communication equipment |
| Metal-Core PCB | Aluminum or copper substrate | LED lighting, power electronics, thermal management |
| Heavy-Copper PCB | Increased copper thickness | Power supplies, battery systems, industrial equipment |
| Sensor PCB Assemblies | Sensors, ICs and connectors | IoT, automation, monitoring systems |
| Control Board Assemblies | MCU, relay and communication circuits | Machinery, HVAC, industrial automation |
| Power Supply Assemblies | Power devices, transformers and heat sinks | Chargers, power supplies, energy equipment |
| LED PCB Assemblies | LED arrays and metal-core boards | Lighting, displays, automotive systems |
| Motor-Control Boards | Driver ICs, MOSFETs and current sensing | Robotics, appliances, electric motors |
| Communication Boards | RF modules, connectors and processors | Telecom, networking, IoT |
| Medical Electronics | Precision PCBAs and controlled assemblies | Diagnostic, monitoring and laboratory equipment |
| Automotive Electronics | Control, sensing and power assemblies | Vehicle electronics and charging equipment |
| Complete Electronic Products | PCBA, cables, enclosure and firmware | OEM and custom electronic devices |
PCB Materials, Thickness and Surface Finishes
For PCB manufacturing, “post-processing” generally refers to the copper surface finish, solder mask, marking, edge treatment, conformal coating, and assembly protection process.
The values below are representative website ranges rather than guaranteed specifications. Final capabilities must be confirmed against the selected stack-up, material supplier, board geometry, copper weight, layer count, drill design, and inspection class.
PCB Materials
| PCB Material | Typical Finished Thickness | Typical Thickness Tolerance | Suitable Surface Finishes / Post-Processing | Relative Cost |
|---|---|---|---|---|
| Standard FR-4 | 0.4–3.2 mm | Approximately ±10% | HASL, Lead-Free HASL, ENIG, OSP, Immersion Tin | ★ |
| High-Tg FR-4 | 0.6–3.2 mm | Approximately ±10% | ENIG, Lead-Free HASL, OSP, Immersion Tin | ★★ |
| Halogen-Free FR-4 | 0.6–3.2 mm | Approximately ±10% | ENIG, OSP, Lead-Free HASL | ★★ |
| Flexible Polyimide | 0.08–0.30 mm | Project-specific | ENIG, OSP, Immersion Tin, Coverlay, Stiffener | ★★★ |
| Rigid-Flex Material | 0.20–2.0 mm | Project-specific | ENIG, Selective Plating, Coverlay, Stiffener | ★★★★★ |
| Aluminum-Core PCB | 0.8–3.2 mm | Approximately ±10% | Lead-Free HASL, ENIG, OSP, White Solder Mask | ★★ |
| Copper-Core PCB | 0.8–3.2 mm | Project-specific | ENIG, OSP, Protective Coating | ★★★★ |
| Rogers-Type RF Laminate | 0.25–3.2 mm | Material-dependent | ENIG, Immersion Silver, Selective Plating | ★★★★ |
| PTFE High-Frequency Laminate | 0.25–3.2 mm | Material-dependent | ENIG, Immersion Silver, Edge Plating | ★★★★★ |
| Ceramic PCB | 0.25–2.0 mm | Project-specific | ENIG, Silver, Gold or Nickel Metallization | ★★★★★ |
| Heavy-Copper FR-4 | 1.0–4.0 mm | Project-specific | ENIG, Lead-Free HASL, OSP | ★★★ |
| HDI FR-4 | 0.6–2.4 mm | Project-specific | ENIG, OSP, Via Filling, Planarization | ★★★★ |
PCB Surface-Finish Options
| Surface Finish | Main Benefits | Common Applications | Relative Cost |
|---|---|---|---|
| Lead-Free HASL | Economical and widely used | General electronics and industrial boards | ★ |
| OSP | Flat surface and economical lead-free option | Fine-pitch SMT and consumer electronics | ★ |
| ENIG | Flat surface, good solderability and corrosion resistance | BGA, fine-pitch, industrial and medical products | ★★★ |
| Immersion Tin | Flat surface and suitable for fine-pitch assembly | Communication and industrial electronics | ★★ |
| Immersion Silver | Flat surface with good electrical performance | RF and high-frequency applications | ★★ |
| Hard Gold | High wear resistance | Edge connectors, switches and contact areas | ★★★★ |
| ENEPIG | Suitable for mixed assembly and wire bonding | Advanced, medical and high-reliability electronics | ★★★★★ |
| Selective Gold Plating | Gold applied only to functional areas | Contacts, connectors and test points | ★★★★ |
PCBA Protection and Post-Processing
| Process | Suitable Applications | Main Benefit |
|---|---|---|
| Conformal Coating | Outdoor, industrial, automotive and humid environments | Moisture, dust and chemical protection |
| Silicone Potting | Power electronics and vibration-sensitive assemblies | Flexible environmental protection |
| Epoxy Potting | Permanent, mechanically protected assemblies | High mechanical and tamper resistance |
| Underfill | BGA and high-stress components | Improved mechanical and thermal reliability |
| Thermal-Pad Installation | Power devices and heat-sensitive components | Improved heat transfer |
| Heat-Sink Installation | Power supplies, motor controllers and LED products | Thermal management |
| Selective Masking | Connectors and test points | Prevents coating on functional areas |
| Cleaning | High-reliability and sensitive electronics | Removes process residues |
| Laser Marking | Traceability and serialization | Permanent identification |
| Label Application | Finished assemblies and products | Product and compliance identification |
PCB and PCBA Design Considerations
Provide Complete Manufacturing Files
For bare PCB fabrication, provide:
- Gerber or ODB++ files
- NC drill files
- Board outline
- Layer stack-up
- Copper weight
- Finished thickness
- Solder-mask requirements
- Surface finish
- Impedance requirements
- Fabrication drawing
For PCBA assembly, also provide:
- Bill of Materials
- Pick-and-place file
- Assembly drawing
- Polarity information
- Approved manufacturer part numbers
- Programming files
- Test instructions
- Special process requirements
Verify Component Footprints
Incorrect land patterns can cause soldering defects, tombstoning, bridging, insufficient solder joints, or component misalignment.
The PCB footprint should be checked against:
- Component datasheet
- Package dimensions
- Pin numbering
- Polarity
- Thermal pad
- Solder-mask openings
- Assembly process

Use Practical Trace Width and Spacing
Very narrow traces and spacing may require advanced fabrication processes and can increase cost and yield risk.
As a general manufacturing reference, standard production commonly favors wider conductors where the design allows. Some commercial fabrication processes list around 0.10/0.10 mm for standard single- or double-sided 1 oz designs, with finer capabilities available under specific multilayer conditions. Final design rules must always be confirmed with the selected PCB stack-up and factory capability
Select Copper Thickness Carefully
Copper thickness should be selected according to:
- Current requirements
- Temperature rise
- Trace width
- Board thickness
- Via design
- Thermal performance
- Etching capability
- Finished copper tolerance
Using heavier copper can improve current capacity but may require wider spacing and increase manufacturing cost.
Plan Via Types Early
Common via options include:
- Through vias
- Blind vias
- Buried vias
- Microvias
- Via-in-pad
- Filled vias
- Tented vias
- Plugged vias
Blind, buried, stacked, staggered, and filled microvias can increase routing density, but they also increase process complexity and cost.
Maintain Component-to-Edge Clearance
Components placed too close to the board edge may be damaged during depaneling, routing, V-scoring, handling, or enclosure installation.
Additional clearance may be required near:
- V-score lines
- Breakaway tabs
- Mounting holes
- Board edges
- Connectors
- Mechanical fasteners
Frequently Asked Questions
What is the difference between PCB and PCBA?
A PCB is the bare printed circuit board without electronic components. A PCBA is a PCB that has been assembled with components through SMT, through-hole, or mixed-technology processes.
What PCB types can GCNOV manufacture?
We can support rigid, flexible, rigid-flex, multilayer, HDI, high-frequency, aluminum-core, copper-core, heavy-copper, and impedance-controlled circuit boards, subject to project review.
What PCBA services do you provide?
Our services include SMT assembly, through-hole assembly, mixed assembly, component sourcing, programming, testing, conformal coating, cable integration, and box-build assembly.
Can you source all electronic components?
Yes, we can provide full-turnkey sourcing. Component availability depends on the approved manufacturer, packaging, market supply, lead time, and minimum order quantity.
Do you support prototype PCB and PCBA orders?
Yes. We support engineering prototypes, design-validation builds, pilot production, low-volume assembly, and repeat production.
Ready to Start Your PCB or PCBA Project?
Send us your design package today. Our team will review your PCB specifications, BOM, assembly requirements, testing needs, production quantity, and delivery schedule before preparing a detailed quotation.
Resources
Introduce some key resources from your blog page.