Rogers 4003C Material Guide

Overview

Rogers 4003C™ is a high-performance RF and microwave laminate developed by Rogers Corporation for high-frequency circuit applications requiring low dielectric loss, stable electrical properties, and cost-effective manufacturing.

Part of the industry-leading RO4000® Series, Rogers 4003C combines woven glass reinforcement with a hydrocarbon ceramic-filled thermoset resin system, providing excellent RF performance while maintaining compatibility with standard FR4 PCB fabrication processes.

Rogers 4003C is widely used in:

  • RF Circuit Boards
  • Microwave Systems
  • 5G Infrastructure
  • Satellite Communications
  • Automotive Radar
  • Aerospace Electronics
  • High-Speed Digital Networks
  • Wireless Communication Equipment

Due to its excellent balance of RF performance, manufacturability, and cost, Rogers 4003C is one of the most commonly used RF laminate materials worldwide.


Material Specification

PropertyValue
Material DesignationRogers 4003C
Material FamilyHydrocarbon Ceramic RF Laminate
Product SeriesRO4000® Series
ReinforcementWoven Glass Fiber
Resin SystemHydrocarbon Thermoset
Filler TypeCeramic Filled
Density1.79 g/cm³
AppearanceLight Tan
Typical Manufacturing MethodsPCB Fabrication, CNC Machining
Standard FormsCopper-Clad Laminates, Core Materials

Material Composition

Rogers 4003C utilizes a proprietary hydrocarbon ceramic composite structure.

ComponentFunction
Hydrocarbon ResinElectrical Stability
Ceramic FillersLow Dielectric Loss
Glass ReinforcementMechanical Strength
Copper FoilCircuit Formation

The ceramic-filled resin system provides improved electrical consistency and thermal performance.


Available Rogers 4003C Variants

GradeCharacteristics
Rogers 4003C StandardGeneral RF Applications
Rogers 4003C LoProLow Profile Copper
Multilayer StackupsRF PCB Systems
Hybrid FR4/Rogers DesignsCost-Optimized RF Boards

Mechanical Properties

Typical Values

PropertyValue
Tensile Strength250–350 MPa
Flexural Strength250–350 MPa
Elastic Modulus16–19 GPa
Compressive Strength300–450 MPa
Dimensional StabilityExcellent

Mechanical Performance

PropertyPerformance
RigidityExcellent
PCB StabilityOutstanding
Mechanical ReliabilityExcellent
Multilayer CompatibilityOutstanding

Rogers 4003C maintains dimensional stability during PCB fabrication and operation.


Physical Properties

PropertyValue
Density1.79 g/cm³
Water Absorption0.06%
Moisture ResistanceExcellent
Surface StabilityExcellent
Dimensional StabilityOutstanding

Low moisture absorption helps preserve dielectric consistency.


Thermal Properties

PropertyValue
Glass Transition Temperature (Tg)>280°C
Decomposition Temperature (Td)>425°C
Continuous Service TemperatureUp to 200°C
Thermal Conductivity0.71 W/m·K
Coefficient of Thermal Expansion (X/Y)11–14 ppm/°C
Coefficient of Thermal Expansion (Z)46 ppm/°C

Rogers 4003C offers significantly improved thermal performance compared with standard FR4 materials.


Strength-to-Weight Ratio

MaterialDensity (g/cm³)Tensile Strength
Rogers 4003C1.79300 MPa
Standard FR41.90400 MPa
Rogers 4350B1.86300 MPa
PTFE RF Laminate2.10200 MPa

The material offers excellent structural stability while optimizing RF performance.


Electrical Properties

Typical Values

PropertyValue
Dielectric Constant (Dk @ 10 GHz)3.38 ± 0.05
Dissipation Factor (Df @ 10 GHz)0.0027
Volume Resistivity>10¹⁰ MΩ·cm
Surface Resistivity>10⁸ MΩ
Dielectric Strength>31 kV/mm

Electrical Performance

PropertyPerformance
Signal IntegrityOutstanding
RF PerformanceOutstanding
Microwave PerformanceOutstanding
High-Speed Digital PerformanceExcellent

Rogers 4003C provides lower dielectric loss than Rogers 4350B, making it particularly attractive for high-frequency applications.


High Frequency Performance

Frequency RangePerformance
RF ApplicationsOutstanding
Microwave ApplicationsOutstanding
Millimeter-Wave ApplicationsExcellent
5G CommunicationsOutstanding
High-Speed Digital SystemsExcellent

The low loss tangent enables efficient signal transmission with minimal attenuation.


Thermal Management Performance

PropertyPerformance
Heat DissipationExcellent
Thermal StabilityOutstanding
Solder ReliabilityExcellent
Power RF ApplicationsExcellent

The ceramic-filled structure improves heat dissipation compared with conventional FR4.


Moisture Resistance

PropertyPerformance
Water AbsorptionVery Low
Humidity StabilityExcellent
RF Stability Under HumidityOutstanding
Environmental ReliabilityExcellent

Minimal moisture uptake ensures consistent RF performance in challenging environments.


Chemical Resistance

Chemical EnvironmentPerformance
WaterExcellent
Flux ChemicalsExcellent
Cleaning AgentsExcellent
Oils & GreasesExcellent
Industrial ChemicalsGood

Compatible with standard PCB manufacturing and assembly processes.


Manufacturing Characteristics

Manufacturing ProcessRating
Multilayer PCB FabricationOutstanding
CNC DrillingExcellent
PCB RoutingExcellent
SMT AssemblyOutstanding
Lead-Free AssemblyOutstanding

Rogers 4003C can be processed using standard FR4 PCB manufacturing equipment.


Machinability

ProcessRating
CNC MillingExcellent
DrillingExcellent
Laser ProcessingGood
Precision PCB FabricationOutstanding

Its FR4-compatible processing reduces manufacturing complexity and costs.


International Standards

StandardCompliance
IPC-4103Yes
RoHSCompliant
REACHCompliant
UL 94V-0
Lead-Free AssemblyCompatible

Available Forms

Product TypeAvailability
Copper-Clad LaminateYes
Core MaterialYes
RF PCB SubstrateYes
Multilayer PCB MaterialYes
High-Speed PCB PanelsYes

Typical Applications

Telecommunications

  • 5G Base Stations
  • RF Power Amplifiers
  • Antenna Systems
  • Wireless Infrastructure

Aerospace Industry

  • Satellite Communications
  • Navigation Systems
  • RF Modules
  • Avionics Electronics

Defense Industry

  • Radar Systems
  • Electronic Warfare Equipment
  • RF Communication Platforms

Automotive Electronics

  • 77 GHz Radar
  • ADAS Systems
  • Vehicle-to-Everything (V2X) Communications

Medical Electronics

  • Wireless Diagnostic Equipment
  • RF Medical Devices
  • Imaging Systems

Industrial Electronics

  • High-Speed Networking
  • RF Sensors
  • Wireless Monitoring Systems

Advantages

Ultra-Low Dielectric Loss

Lower loss tangent than many competing RF laminates.

Stable Dielectric Constant

Excellent electrical consistency across frequency ranges.

FR4-Compatible Manufacturing

Reduces PCB fabrication complexity and cost.

Excellent Thermal Stability

Supports demanding RF and microwave environments.

Low Moisture Absorption

Maintains RF performance in humid conditions.

Cost-Effective RF Solution

Offers excellent RF performance at a lower cost than PTFE-based laminates.


Limitations

Higher Cost Than FR4

More expensive than standard PCB substrates.

Not the Lowest-Loss RF Material

PTFE-based laminates may outperform Rogers 4003C at extremely high frequencies.

Requires RF Design Expertise

Proper stackup and impedance control are critical.

Limited Availability Compared with FR4

Lead times may be longer than standard PCB materials.


Comparison with PCB Materials

PropertyRogers 4003CRogers 4350BStandard FR4PTFE Laminate
Dielectric Constant3.383.484.3–4.82.1–2.6
Loss Tangent0.00270.00370.015–0.0250.0009–0.002
RF PerformanceOutstandingOutstandingPoorOutstanding
Thermal StabilityExcellentExcellentGoodExcellent
CostHighHighLowVery High

Comparison with Rogers 4350B

PropertyRogers 4003CRogers 4350B
Dielectric Constant (Dk)Lower
Loss Tangent (Df)Lower
Thermal ConductivityHigher
Multilayer ReliabilityGood
Thermal Expansion ControlSlightly Lower

Rogers 4003C is often selected when minimizing RF loss is the primary objective, while Rogers 4350B is preferred when superior thermal-mechanical stability is required.


Available Surface Finishes

Standard Finishes

  • Copper-Clad Surface
  • Low Profile Copper
  • RF PCB Surface

Functional Finishes

  • Microwave Optimized Surface
  • High-Speed Digital Surface
  • Low-Loss RF Surface

Specialty Configurations

  • Rogers 4003C Standard
  • Rogers 4003C LoPro
  • Hybrid Rogers-FR4 Stackups
  • Multilayer RF PCB Systems

Frequently Asked Questions (FAQ)

What is Rogers 4003C?

Rogers 4003C is a low-loss hydrocarbon ceramic RF laminate designed for microwave, RF, millimeter-wave, and high-speed digital PCB applications.

What is Rogers 4003C used for?

Typical applications include:

  • 5G Infrastructure
  • Radar Systems
  • RF Amplifiers
  • Satellite Communications
  • High-Speed Networking

What is the dielectric constant of Rogers 4003C?

The dielectric constant (Dk) is approximately 3.38 at 10 GHz.

Why choose Rogers 4003C over FR4?

Because it offers lower signal loss, better RF performance, more stable dielectric properties, and superior high-frequency reliability.

Is Rogers 4003C suitable for multilayer PCBs?

Yes. It is widely used in multilayer RF and microwave PCB designs.

Why choose Rogers 4003C?

Because it combines:

  • Low Dielectric Loss
  • Stable RF Performance
  • Excellent Thermal Stability
  • FR4-Compatible Processing
  • Cost-Effective RF Performance

What is the difference between Rogers 4003C and Rogers 4350B?

Rogers 4003C offers lower dielectric constant and lower loss tangent, while Rogers 4350B provides enhanced thermal-mechanical performance and improved multilayer reliability.

Does GCNOV provide Rogers 4003C manufacturing services?

Yes. GCNOV provides:

  • Rogers 4003C PCB Fabrication Support
  • RF PCB Manufacturing
  • High-Frequency PCB Prototyping
  • CNC Machining Services
  • Prototype Development
  • Low-Volume Production
  • Mass Production