Rogers 4350B Material Guide

Overview

Rogers 4350B™ is a high-frequency, low-loss, thermoset hydrocarbon ceramic-filled laminate developed by Rogers Corporation for RF, microwave, millimeter-wave, and high-speed digital circuit applications.

Unlike conventional FR4 materials, Rogers 4350B offers significantly lower dielectric loss, excellent signal integrity, superior thermal stability, and highly consistent electrical performance across a broad frequency range. It is widely regarded as one of the industry’s leading materials for RF PCB design.

Rogers 4350B is widely used in:

  • 5G Infrastructure
  • RF Antennas
  • Microwave Circuits
  • Aerospace Electronics
  • Defense Systems
  • Satellite Communications
  • Radar Systems
  • High-Speed Digital Networks

Due to its combination of low dielectric loss and FR4-compatible processing, Rogers 4350B has become one of the most widely adopted RF PCB materials worldwide.


Material Specification

PropertyValue
Material DesignationRogers 4350B
Material FamilyHydrocarbon Ceramic Laminate
ReinforcementWoven Glass Fiber
Resin SystemThermoset Hydrocarbon
Filler TypeCeramic Filled
Density1.86 g/cm³
AppearanceLight Tan
Typical Manufacturing MethodsPCB Fabrication, CNC Machining
Standard FormsCopper-Clad Laminates, Core Materials

Material Composition

Rogers 4350B combines hydrocarbon resin technology with ceramic fillers.

ComponentFunction
Hydrocarbon ResinElectrical Stability
Ceramic FillersLow Loss & Thermal Performance
Glass ReinforcementMechanical Stability
Copper CladdingCircuit Formation

The ceramic-filled structure provides excellent electrical consistency and dimensional stability.


Available Rogers 4350B Variants

GradeCharacteristics
Rogers 4350BStandard RF Laminate
Rogers 4450FBonding Film Companion Material
Rogers 4350B LoProLow Profile Copper Version
Multi-Layer ConfigurationsHigh Frequency PCB Systems

Mechanical Properties

Typical Values

PropertyValue
Tensile Strength250–350 MPa
Flexural Strength250–350 MPa
Elastic Modulus16–19 GPa
Compressive Strength300–450 MPa
Dimensional StabilityExcellent

Mechanical Performance

PropertyPerformance
RigidityExcellent
Mechanical ReliabilityExcellent
PCB StabilityOutstanding
Multilayer CompatibilityOutstanding

Rogers 4350B provides excellent structural stability for precision RF applications.


Physical Properties

PropertyValue
Density1.86 g/cm³
Water Absorption0.06%
Moisture ResistanceExcellent
Surface StabilityOutstanding
Dimensional StabilityExcellent

Very low moisture absorption helps maintain RF performance in humid environments.


Thermal Properties

PropertyValue
Glass Transition Temperature (Tg)>280°C
Decomposition Temperature (Td)>390°C
Continuous Service TemperatureUp to 200°C
Thermal Conductivity0.62 W/m·K
Coefficient of Thermal Expansion (X/Y)11–14 ppm/°C
Coefficient of Thermal Expansion (Z)32 ppm/°C

Rogers 4350B offers significantly better thermal stability than conventional FR4.


Strength-to-Weight Ratio

MaterialDensity (g/cm³)Tensile Strength
Rogers 4350B1.86300 MPa
Standard FR41.90400 MPa
High Tg FR41.90450 MPa
PTFE RF Laminate2.10200 MPa

While mechanical strength is slightly lower than FR4, Rogers 4350B provides vastly superior RF performance.


Electrical Properties

Typical Values

PropertyValue
Dielectric Constant (Dk @ 10 GHz)3.48 ± 0.05
Dissipation Factor (Df @ 10 GHz)0.0037
Volume Resistivity>10¹⁰ MΩ·cm
Surface Resistivity>10⁸ MΩ
Dielectric Strength>31 kV/mm

Electrical Performance

PropertyPerformance
Signal IntegrityOutstanding
RF PerformanceOutstanding
Microwave PerformanceOutstanding
High-Speed Digital PerformanceExcellent

These electrical properties are the primary reason engineers choose Rogers 4350B over FR4.


High Frequency Performance

Frequency RangePerformance
RF ApplicationsOutstanding
Microwave ApplicationsOutstanding
Millimeter Wave ApplicationsExcellent
5G ApplicationsOutstanding
High-Speed Digital SystemsExcellent

Rogers 4350B is specifically optimized for high-frequency signal transmission.


Thermal Management Performance

PropertyPerformance
Heat DissipationExcellent
Thermal StabilityOutstanding
Solder ReliabilityExcellent
Power Electronics SuitabilityExcellent

The ceramic filler system enhances thermal conductivity compared with conventional FR4.


Moisture Resistance

PropertyPerformance
Water AbsorptionVery Low
Humidity StabilityExcellent
RF Stability Under HumidityOutstanding
Environmental ReliabilityExcellent

Low moisture absorption minimizes dielectric drift in challenging environments.


Chemical Resistance

Chemical EnvironmentPerformance
WaterExcellent
Flux ChemicalsExcellent
Cleaning AgentsExcellent
Oils & GreasesExcellent
Industrial ChemicalsGood

Suitable for standard PCB manufacturing and assembly processes.


Manufacturing Characteristics

Manufacturing ProcessRating
Multilayer PCB FabricationOutstanding
CNC DrillingExcellent
PCB RoutingExcellent
Lead-Free AssemblyOutstanding
SMT CompatibilityOutstanding

One of the key advantages of Rogers 4350B is its compatibility with standard FR4 manufacturing processes.


Machinability

ProcessRating
CNC MillingExcellent
DrillingExcellent
Laser ProcessingGood
Precision PCB FabricationOutstanding

Manufacturing processes are very similar to traditional FR4 PCB production.


International Standards

StandardCompliance
IPC-4103Yes
RoHSCompliant
REACHCompliant
UL 94V-0
Lead-Free AssemblyCompatible

Available Forms

Product TypeAvailability
Copper-Clad LaminateYes
Core MaterialYes
Multilayer PCB MaterialYes
RF PCB PanelsYes
High-Speed PCB SubstrateYes

Typical Applications

Telecommunications

  • 5G Base Stations
  • RF Power Amplifiers
  • Antenna Systems
  • Network Infrastructure

Aerospace Industry

  • Avionics Systems
  • Satellite Electronics
  • Communication Modules
  • Radar Systems

Defense Industry

  • Electronic Warfare Systems
  • Radar Equipment
  • Secure Communications
  • RF Signal Processing

Automotive Electronics

  • Automotive Radar
  • ADAS Systems
  • Vehicle Communications
  • Connected Vehicle Electronics

Medical Electronics

  • RF Imaging Systems
  • Wireless Medical Devices
  • Diagnostic Equipment

Industrial Electronics

  • High-Speed Data Systems
  • RF Monitoring Equipment
  • Industrial Wireless Networks

Advantages

Low Dielectric Loss

Excellent signal transmission with minimal attenuation.

Stable Dielectric Constant

Predictable RF performance across frequency ranges.

High Thermal Stability

Suitable for demanding thermal environments.

FR4-Compatible Processing

Reduces manufacturing complexity and cost.

Excellent Moisture Resistance

Maintains performance in humid environments.

Proven RF Industry Standard

Widely used in aerospace, defense, telecommunications, and high-speed electronics.


Limitations

Higher Cost Than FR4

Significantly more expensive than standard PCB materials.

Overkill for Low-Speed Electronics

Not necessary for conventional digital PCB applications.

More Complex PCB Design Requirements

Requires RF design expertise to maximize performance.

Lower Availability Than FR4

May have longer procurement lead times.


Comparison with PCB Materials

PropertyRogers 4350BStandard FR4High Tg FR4PTFE Laminate
Dielectric Constant StabilityOutstandingGoodGoodOutstanding
Loss TangentOutstandingModerateModerateOutstanding
RF PerformanceOutstandingPoorModerateOutstanding
Thermal StabilityExcellentGoodExcellentExcellent
CostHighLowModerateVery High

Comparison with Standard FR4

PropertyRogers 4350BStandard FR4
RF PerformanceMuch Better
Signal LossMuch Lower
Thermal StabilityBetter
Moisture StabilityBetter
CostHigher

For RF and microwave circuits, Rogers 4350B significantly outperforms standard FR4.


Available Surface Finishes

Standard Finishes

  • Copper-Clad Surface
  • Low Profile Copper
  • Standard PCB Surface

Functional Finishes

  • RF Optimized Surface
  • Microwave Grade Surface
  • High-Speed Digital Surface

Specialty Configurations

  • Rogers 4350B
  • Rogers 4350B LoPro
  • Multilayer RF Stackups
  • High-Frequency PCB Systems

Frequently Asked Questions (FAQ)

What is Rogers 4350B?

Rogers 4350B is a low-loss hydrocarbon ceramic-filled RF laminate designed for microwave, RF, and high-speed digital PCB applications.

What is Rogers 4350B used for?

Typical applications include:

  • 5G Infrastructure
  • Radar Systems
  • RF Amplifiers
  • Satellite Communications
  • Aerospace Electronics

Why is Rogers 4350B better than FR4 for RF applications?

Because it offers a lower loss tangent, more stable dielectric constant, better signal integrity, and superior high-frequency performance.

Is Rogers 4350B suitable for multilayer PCBs?

Yes. It is widely used in multilayer RF and microwave PCB designs.

Is Rogers 4350B compatible with lead-free assembly?

Yes. It supports modern lead-free PCB manufacturing processes.

Why choose Rogers 4350B?

Because it combines:

  • Low Dielectric Loss
  • Stable Dk Performance
  • Excellent Thermal Stability
  • RF Optimization
  • Manufacturing Compatibility

What is the difference between Rogers 4350B and PTFE laminates?

Rogers 4350B offers easier processing and FR4-compatible fabrication, while PTFE materials may provide even lower RF losses but require more specialized manufacturing.

Does GCNOV provide Rogers 4350B manufacturing services?

Yes. GCNOV provides:

  • Rogers 4350B PCB Fabrication Support
  • RF PCB Manufacturing
  • CNC Machining Services
  • Precision Electronic Components
  • Prototype Development
  • Low-Volume Production
  • Mass Production